Design Ability
Including electronic design, plastic design and mechanism design
Plastic and Mold
* Mold design and manufacturing
* Plastic Injection: 90T~800T
PCB Assemblies
Capable of process the PCBs with one layer, double layer and multiple layer, maximum to 510mm
* Chip On Board assembly (C.O.B.)
* Surface-Mount Technology (SMT)
* DIPˇ]Through hole assemblyˇ^
* Wave soldering and aqueous cleaning
Various Finishing Processes
* Silk Screening
* Painting
* Pad-Printing
* Hot-Stamping
Assembly Production Line
* Four various assembly line
Motor
* Wiring
* Semi-Finished product handling
Testing Equipments
* Cycle temperature and humidity chamber
* In-Circuit testers
* AOI (automatic optical inspection)
* Salt spray chamber
* Vibration testing
* RoHS Analyzer
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